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Double Platform Depaneling Machine, as a precision equipment developed by our company to meet with market demands, is mainly used for shape cutting and depaneling FPC and PCB product, etc.
The equipment consists of a laser cutting mechanism,cutting and positioning mechanism, cutting and dust removal mechanism and cutting platform mechanism.
Lengths and widths for cutting various products can be adjusted manually.
Features of Double Platform Laser Depaneling Machine are Strong Compatibility, High Precision,Fast Speed, Good Stability, and Compact Size, etc.
Both software and hardware are completely developed by our company, which is friendly to use.
| Equipment | Double Platform High Precision Laser Cutting Machine |
| Style No. | WXR-220UD |
| Laser | 20W UV Laser,Nanosecond |
| Cutting Format | 350mm×500mm |
| Platform | Double Platform |
| Application Objects | PCB |
| Comprehensive Accuracy | ±0.025mm |
| Loading and Unloading | Manually |
| Support Files | DXF ,etc |
| Operation System | WIN10 |
| Equipment Weight | About 2.5 Ton |
Application Field
Semiconduct、Integrated Circuits、Communication、and Lighting, etc
Appliction Objects
LCP、MPI、PI、FR4、FR5 and CEM and Polyester, Ceramic and other RF material
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+86 13686619241
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