Is one of the most extensive layout of process solutions in the field of PCB special production equipment in the world; It covers conventional rigid multi-layer board, high-density interconnection board (HDI), SLP, and IC Substrate. Key processes such as drilling, exposure (inner layer, outer layer, solder resistance), molding, electrical performance testing, bonding and automation of all subdivision PCB products, including mechanical drilling machine, CO2/UV/ ultrafast laser drilling machine drilling solutions, LDI laser direct imaging solutions, Mechanical forming, laser forming program, special/general/high precision test program, steel sheet reinforcing machine and auxiliary material attachment and other series and variety of process solutions.